改性双马来酰亚胺树脂耐温性的研究Study on the Temperature Resistance of Modified Bismaleimide Resin
段长兵,王大伟,王宝铭
DUAN Chang-bing,WANG Da-wei,WANG Bao-ming
摘要(Abstract):
将二烯丙基双酚A、邻苯二甲酸二烯丙酯、环氧树脂、苯氧基树脂按照不同比例添加到双马来酰亚胺树脂体系中,制备改性双马来酰亚胺树脂样条。通过动态热力学分析仪测试改性双马来酰亚胺树脂的玻璃化转变温度。测试结果表明配方a的玻璃化转变温度最高,耐温性最好。
The diallyl bisphenol A, diallyl phthalate, epoxy resin, phenoxy resin were added to the bisma-leimide resin system in different proportions. The bismaleimide resin spline was prepared. By dynamic ther-mal analyzer, the glass transition temperature of modified bismaleimide resin was tested. The test resultsshow that the glass transition temperature of formula a is the highest and the temperature resistance is thebest.
关键词(KeyWords):
双马来酰亚胺树脂;二烯丙基双酚A;邻苯二甲酸二烯丙酯;苯氧基树脂;耐温性
bismaleimide resin;diallyl bisphenol A;diallyl phthalate;phenoxy resin;temperature resistance
基金项目(Foundation):
作者(Author):
段长兵,王大伟,王宝铭
DUAN Chang-bing,WANG Da-wei,WANG Bao-ming
DOI: 10.16090/j.cnki.hcxw.20180913.003
参考文献(References):
- [1]宁志强,徐晓沐.双马来酰亚胺树脂的增韧改性研究[J].化学与黏合,2007,29(1):345-346,364.
- [2]程雷,王汝敏,王小建,等.烯丙基化合物改性双马来酰亚胺树脂的研究进展[J].中国胶粘剂,2009,18(4):62-67.
- [3]HERGENROTHER P M.Thernally curable oligomers and high temperature polymers thereform[J].Polymer Prepreg,1984,25(1):97-99.
- [4]STENZENBERGER H D.Recent advances in thermosetting polyimides[J].Polymer,1983,20(5):383-396.
- [5]WHITE J E.Synthesis and properties of high-molecular-weight stepgrowth polymers from bismaleimides[J].Chemistry Product Research and Development,1986,25:395-400.
- [6]王汝敏,杨利,郑水蓉,等.聚醚砜增韧双马来酰亚胺树脂研究[J].西北工业大学学报,2002,20(1):45-150.
- [7]刘孝波,江璐.含芳酰胺键的液晶双马来酰亚胺的合成与表征[J].合成树脂及塑料,1997,14(4):19-21,37.